MULTILAYER ELECTRONIC COMPONENT
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United States of America Patent
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Issued Date -
Jul 4, 2024
app pub date -
Dec 14, 2023
filing date -
Dec 29, 2022
priority date (Note) -
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Abstract
A multilayer electronic component may include: a body including a dielectric layer and internal electrodes; and external electrodes including an electrode layer disposed on the body and a plating layer disposed on the electrode layer, wherein the plating layer includes an extension extending onto the body to contact the body, and the extension includes one or more grains in which an angle between a surface of the body in contact with the extension and a major axis of the grain is 70 degrees or greater and 110 degrees or less.
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