MODULAR ELECTRICAL WIRING DEVICE PLATFORM AND ASSEMBLIES
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United States of America Patent
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Issued Date -
Jul 4, 2024
app pub date -
Dec 27, 2023
filing date -
Dec 28, 2022
priority date (Note) -
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status (Latency Note)
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Abstract
A powered subplate device, the device including a front face and a rear face. The front face includes a recessed portion extending from the front face toward the back face, where the recessed portion is configured to receive an electrical wiring device, and the recessed portion includes one or more receptacle terminals. The one or more receptacle terminals extend perpendicular to the front face, where a rear facing end of the one or more receptacle terminals are configured to connect to AC wires on the rear face of the powered subplate. The front facing end of the one or more receptacle terminals are configured to mate with plug blades of the electrical wiring device.
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