Importance

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Abstract

A workpiece grinding method includes a first grinding step of grinding a part of a back surface corresponding to a device region of a workpiece using a first grinding wheel to form a first circular recess and an annular projecting part in the back surface, and a second grinding step of grinding at least a bottom surface of the first circular recess using a second grinding wheel including a grindstone having a particle diameter smaller than that of the first grinding wheel. In the first grinding step, the bottom surface of the first circular recess is ground into a concentrical shape differing in thickness in a radial direction from a center to a circumference of the first circular recess. In the second grinding step, the bottom surface of the first circular recess is ground to have a uniform thickness, thereby forming a second circular recess.

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First Claim