WATERBORNE ADHESIVES FOR REDUCED BASIS WEIGHT MULTILAYER SUBSTRATES AND USE THEREOF

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United States of America Patent

APP PUB NO 20240228835A1
SERIAL NO

18617910

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Abstract

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The adhesive composition comprising emulsion polymers and microspheres and articles made therefrom are provided. The adhesive is particularly suitable for packages for consumer products that provide sufficient strength and thermal insulation while reducing the overall basis weight of the substrates.

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Patent Owner(s)

Patent OwnerAddress
HENKEL AG & CO KGAAHENKELSTRASSE 67 DUESSELDORF 40589

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
HUANG, Tianjian Hillsborough, US 35 212
Meccia, John Ringoes, US 17 75
Thompson, Kristina Clinton, US 18 89
Waski, Daniel Elmhurst, US 23 162

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