CLEANING OPERATIONS BASED ON DEPOSITION THICKNESS
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United States of America Patent
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Issued Date -
Jul 11, 2024
app pub date -
Jan 5, 2023
filing date -
Jan 5, 2023
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Abstract
A method includes identifying deposition thickness property data associated with an amount of material deposited via one or more substrate processing operations of a process recipe performed in a processing chamber. The method further includes determining, based on the deposition thickness property data and a variable clean time relationship of the process recipe, cleaning operation parameters. The method further includes causing, based on the cleaning operation parameters, a cleaning operation in the processing chamber.
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