WAFER CLEANING APPARATUS
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United States of America Patent
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Issued Date -
Jul 18, 2024
app pub date -
Dec 21, 2023
filing date -
Jan 12, 2023
priority date (Note) -
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Abstract
A wafer cleaning apparatus including a rotating plate configured to support a wafer thereon, and a cleaning unit above the rotating plate and configured to spray cleaning water, wherein the cleaning unit includes a body, a nozzle in the body, at least one supply pipe connected to the nozzle and configured to supply a cleaning substance, and a discharge member at a lower end portion of the nozzle and configured to discharge the cleaning water, which includes the cleaning substance, wherein the discharge member has a spraying port configured spray the cleaning water therethrough, and wherein the spraying port has an X shape may be provided.
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