OPTIMISED STRUCTURE FOR REGULATING HEAT VIA HEAT PIPE FOR ELECTRONIC EQUIPMENT SUPPORT PANELS
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United States of America Patent
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Issued Date -
Jul 18, 2024
app pub date -
May 31, 2022
filing date -
May 31, 2021
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Abstract
A profile section for an equipment support panel. The profile section is formed in one piece, comprising a tube suitable for forming a heat pipe by introducing and confining a heat-transfer fluid inside of same, and a groove provided to form a rail along its length for securing at least one piece of equipment supported by the panel, this groove being shaped to form-fittingly engage with an attachment member rigidly connected to the at least one piece of equipment.
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