ELECTROLYTIC POLISHING DEVICE, SYSTEM AND METHOD
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United States of America Patent
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Issued Date -
Jul 18, 2024
app pub date -
Oct 20, 2023
filing date -
Jan 13, 2023
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Abstract
An electrolytic polishing device is provided and includes an electrolytic bath used for accommodating an electrolyte. A polishing channel for a to-be-polished workpiece to pass through is provided in the electrolytic bath. An anode plate assembly and a cathode plate assembly are arranged in the electrolytic bath along the extending direction of the polishing channel and are separated by a partition plate assembly. The anode plate assembly includes two anode plates, which are oppositely arranged and respectively located on two sides of the polishing channel. The cathode plate assembly includes two cathode plates, which are oppositely arranged and respectively located on two sides of the polishing channel. The partition plate assembly includes two partition plates, which are oppositely arranged and respectively located on two sides of the polishing channel. The anode plate assembly and the cathode plate assembly can be connected with a power supply.
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