Metal Foil for Circuit Board, Metal Foil with Carrier, Copper-Clad Laminate and Printed Circuit Board
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United States of America Patent
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Issued Date -
Jul 18, 2024
app pub date -
May 30, 2022
filing date -
Jun 8, 2021
priority date (Note) -
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status (Latency Note)
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Abstract
The disclosure discloses a metal foil, a metal foil with a carrier, a copper-clad laminate and a Printed Circuit Board. Herein, a plurality of protrusions are distributed on one face of the metal foil, and the protrusions have the follow microscopic morphology: the lower half part of the protrusion connected with the one face of the metal foil is provided with a limiting part, and the diameter of a circumscribed circle of the cross section of the limiting part is smaller than the skin depth of the metal foil; and the surface area of the part of the protrusion above the limiting part is larger than the surface area of other parts of the protrusion.
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