MULTILAYER ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREOF
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United States of America Patent
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Issued Date -
Jul 25, 2024
app pub date -
Dec 15, 2023
filing date -
Jan 19, 2023
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Abstract
In a multilayer electronic component according to an aspect or another aspect of the present disclosure, a protective layer including a plurality of oxides having a wired form is disposed on at least a portion of an external surface of a body. Alternatively or optionally, the protective layer including an oxide having a wired form is disposed on at least a portion of a space between the body and a side margin portion. A surface of the multilayer electronic component has superhydrophobicity, thereby improving moisture resistance reliability of the multilayer electronic component.
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