PRINTED WIRING BOARD
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United States of America Patent
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Issued Date -
Jul 25, 2024
app pub date -
Jan 24, 2024
filing date -
Jan 25, 2023
priority date (Note) -
Published
status (Latency Note)
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Abstract
A printed wiring board includes a first conductor layer, a resin insulating layer, a second conductor layer, and a via conductor formed in an opening of the insulating layer and connecting the first conductor and second conductor layers. The second conductor layer and via conductor include a seed layer having a first portion formed on the surface of the insulating layer, a second portion formed on an inner wall surface in the opening, and a third portion formed on a portion of the first conductor layer exposed by the opening. A thickness of the first portion is greater than a thickness of the second portion and a thickness of the third portion. The seed layer includes a first layer including an alloy including copper, aluminum and one or more metals selected from nickel, zinc, gallium, silicon, and magnesium, and a second layer formed on the first layer and including copper.
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