MANUFACTURING DEVICE AND MANUFACTURING METHOD FOR SINTERED BODY

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United States of America Patent

APP PUB NO 20240253118A1
SERIAL NO

18416041

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Abstract

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In a manufacturing method for a sintered body, a mold device including a die, first and second punches, first and second spacers, first and second rams, and a plurality of thermal resistors is used. The manufacturing method includes an operation of loading raw material powder into a cavity of the die and then sintering the raw material powder, while pressing and molding the raw material powder in the uniaxial direction using the first and second punches, to form a sintered body and an operation of cooling the formed sintered body. In the operation of cooling the formed sintered body, an acoustic emission (AE) waveform is detected from the formed sintered body, and it is determined whether a crack has occurred in the formed sintered body using the detected AE waveform.

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Patent Owner(s)

Patent OwnerAddress
SAMSUNG ELECTRONICS CO LTDGYEONGGI-DO 16677

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Iizuka, Toshihiro Yokohama-shi, JP 32 410
Kim, Changhwan Suwon-si, KR 29 162
Nagayama, Kenichi Yokohama-shi, JP 65 1453
Noguchi, Takafumi Yokohama-shi, JP 76 513

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