LAYERED RADIATOR FOR EFFICIENT HEAT REJECTION
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United States of America Patent
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Issued Date -
Aug 1, 2024
app pub date -
Apr 14, 2024
filing date -
Jul 28, 2020
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Abstract
A radiator assembly having a plurality of thermally conductive layers arranged in a stack of layers and a heat transfer clamping bracket operably coupled to a first end of the layers of the stack, the clamping bracket being configured to deliver heat from a heat source to the layers. Each stack of layers has a tapered overall shape in cross section due to sequentially shorter lengths of the thermally conductive layers exposing a second end of each layer to a surrounding environment for heat rejection, a total thickness of the stack diminishing with distance away from said heat transfer clamping bracket.
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