METHODS AND APPARATUS FOR PREPARING THIN-FILM SPECIMENS
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United States of America Patent
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Issued Date -
Aug 1, 2024
app pub date -
Jan 30, 2024
filing date -
Jan 31, 2023
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Abstract
Systems and methods are provided for enhanced thin-film specimen preparation solutions. A cutting device may be used in preparing thin-film specimens. The cutting device may have one or more cutting elements configured to apply uniform cuts into a thin-film specimen sheet as the cutting device is moved over the thin-film specimen sheet. A cutting base may be used to maintain the thin-film specimen sheet in place as the cutting device is moved to apply the cuts. The cutting base may be configured for placement on top of the thin-film specimen sheet. The cutting base and the cutting device are integrated together, or may be separate components. The one or more cutting elements may be rotating blades. The one or more cutting elements may be evenly spaced
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