PURGE SYSTEM TO CLEAN WAFER BACKSIDE FOR RING SUSCEPTOR
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United States of America Patent
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Issued Date -
Aug 1, 2024
app pub date -
Jan 22, 2024
filing date -
Jan 26, 2023
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Abstract
A method and apparatus for processing substrates applicable for use in semiconductor manufacturing. The method includes rotating a first shaft having a first perforation where at least a part of the first shaft is disposed within a second shaft. The method further includes flowing a gas through a piping, where the piping is coupled to a second perforation in the second shaft. The method also includes flowing the gas through the second perforation and the first perforation into an interior of the first shaft. The method further includes flowing the gas from the interior of the first shaft to an underside of a substrate disposed within a processing chamber.
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