SUBSTRATES AND RELATED METHODS

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United States of America Patent

APP PUB NO 20240258181A1
SERIAL NO

18160450

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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Implementations of a substrate may include an electrically insulative layer having a first largest planar side and a second largest planar side opposing the first largest planar side; a first electrically conductive layer coupled to the first largest planar side and including a first scalloped edge having a first pattern; and a second electrically conductive layer coupled to the second largest planar side and including a second scalloped edge having a second pattern. The first pattern and the second pattern may alternate along at least one edge of the first largest planar side and at least one edge of the second largest planar side, respectively.

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Patent Owner(s)

Patent OwnerAddress
SEMICONDUCTOR COMPONENTS INDUSTRIES LLC5701 N PIMA ROAD SCOTTSDALE AS 85250

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
CHEW, Chee Hiong Seremban, MY 118 398
NG, Vemmond Jeng Hung Senawang, MY 9 9
PRAJUCKAMOL, Atapol Thanyaburi, TH 66 112
YAO, Yushuang Shenzhen, CN 38 56

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