CERAMIC COPPER CIRCUIT BOARD AND SEMICONDUCTOR DEVICE USING SAME
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United States of America Patent
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Issued Date -
Aug 1, 2024
app pub date -
Apr 9, 2024
filing date -
Oct 25, 2021
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Abstract
A ceramic copper circuit board according to an embodiment includes a ceramic substrate, and a copper circuit part bonded to at least one surface of the ceramic substrate via a brazing material layer. The brazing material layer includes one or two selected from Cu, Ti, Sn, or In. The brazing material layer includes a bonding part located between the ceramic substrate and the copper circuit part, and a first jutting part located at a periphery of the bonding part; and a titanium content of the first jutting part is within a range of not less than 70 mass % and not more than 100 mass %. It is favorable for the total of the titanium content and the nitrogen content of the first jutting part to be not less than 99 mass % and not more than 100 mass %.
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