COPPER ALLOY, SEMIFINISHED PRODUCT AND ELECTRICAL CONNECTING ELEMENT COMPRISING A COPPER ALLOY
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United States of America Patent
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Issued Date -
Aug 8, 2024
app pub date -
Feb 2, 2024
filing date -
Feb 3, 2023
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Abstract
The composition of a copper alloy is as follows: Sn: 3.0-6.5%; Ni: 0.30-0.70%; P: 0.15-0.40%; S: 0.10-0.40%; Zn: optionally up to 0.20%; Fe: optionally up to 0.50%; Mn: optionally up to 0.50%; Pb: optionally up to 0.25%, with the balance being copper and unavoidable impurities. The ratio of fraction of Ni to fraction of P is at least 1.1 and at most 2.8, and the alloy include nickel phosphides.
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