CIRCUIT BOARD
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United States of America Patent
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Issued Date -
Aug 8, 2024
app pub date -
Jun 15, 2022
filing date -
Jun 18, 2021
priority date (Note) -
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status (Latency Note)
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Abstract
A circuit board is disclosed that includes a plurality of circuit board layers located one on top of the other. The plurality of circuit board layers includes a topmost circuit board layer and a bottommost circuit board layer, wherein the topmost circuit board layer forms a top of the circuit board, wherein the bottommost circuit board layer forms a bottom of the circuit board, and wherein the plurality of circuit board layers together forms an end circuit-board edge that runs perpendicularly to the top and the bottom of the circuit board. The end circuit-board edge is provided with a coating made of an insulating material.
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