Electronic device and manufacturing method thereof
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United States of America Patent
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Issued Date -
Aug 15, 2024
app pub date -
Jan 8, 2024
filing date -
Feb 13, 2023
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Abstract
The disclosure discloses a manufacturing method of an electronic device, which comprises the following steps: providing a first substrate, providing a second substrate, bonding the first substrate and the second substrate through an adhesive layer, forming a conductive layer on the side surfaces of the first substrate, the second substrate and the adhesive layer, performing a first patterning process on a first region of the conductive layer, and performing a second patterning process on a second region of the conductive layer, the first region at least partially overlaps the adhesive layer, and the second region overlaps the side surfaces of the first substrate and the second substrate, and the first patterning process is different from the second patterning process.
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