CIRCUIT BOARD STRUCTURE WITH EMBEDDED CERAMIC SUBSTRATE AND MANUFACTURING PROCESS THEREOF
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United States of America Patent
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Issued Date -
Aug 15, 2024
app pub date -
May 3, 2023
filing date -
Feb 9, 2023
priority date (Note) -
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status (Latency Note)
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Abstract
This disclosure is related to a circuit board structure with an embedded ceramic substrate. A circuit substrate includes an insulating base, a first copper foil and a through-hole portion. A ceramic substrate is disposed in the through-hole portion and includes a ceramic substrate and a second copper foil. A plurality of positioning parts are arranged between the insulating base and the ceramic base. An adhesive layer is disposed between the insulating base and the ceramic base to seal the through-hole portion. A metal layer is disposed on the first copper foil and the second copper foil to cover the adhesive layer exposed from the through-hole portion. The metal layer is patterned to form a circuit layer. This disclosure also provides a manufacturing process of a circuit board structure with an embedded ceramic substrate.
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