CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
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United States of America Patent
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Issued Date -
Aug 15, 2024
app pub date -
May 25, 2023
filing date -
Feb 9, 2023
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Abstract
A manufacturing method of a circuit board. The manufacturing method includes: providing a first substrate; forming an opening on the first substrate; disposing a second substrate, which has a plurality of through holes in the opening; forming an adhesive layer between the first substrate and the second substrate; forming a bonding layer on the first substrate and the second substrate; forming a metal layer on the bonding layer; and patterning the metal layer to form a circuit layer. A circuit board is also disclosed in the disclosure.
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