WIRING BOARD AND WIRING BOARD MANUFACTURING METHOD
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United States of America Patent
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Issued Date -
Aug 15, 2024
app pub date -
Jan 30, 2024
filing date -
Feb 9, 2023
priority date (Note) -
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status (Latency Note)
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Abstract
A wiring board includes a wiring layer, an insulating layer, an oxide thin film, a seed layer, and a conductive layer. The insulating layer is laminated on the wiring layer and includes an opening portion that penetrates until the wiring layer. The oxide thin film is formed on a surface of the insulating layer including an inner wall surface of the opening portion. The seed layer is made of metal and that is laminated on the oxide thin film at a position of the opening portion. The conductive layer is formed on the seed layer. The oxide thin film is a thin film that has a thickness of 1 to 100 angstroms and covers a surface of the insulating layer including the inner wall surface of the opening portion and a surface of the wiring layer exposed from a bottom portion of the opening portion.
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