A METHOD FOR PLACING SEEDS INSIDE A GROWTH SUBSTRATE, A SEED INSERTION DEVICE AND A GROWTH SUBSTRATE
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United States of America Patent
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Aug 22, 2024
app pub date -
Jun 6, 2022
filing date -
Jun 7, 2021
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Abstract
A method for placing seeds inside a growth substrate by a seed insertion device including the steps of: arranging the seed insertion device in contact with the growth substrate such that a tip of the seed insertion device penetrates through an outer surface of the growth substrate; creating a growth pocket inside the growth substrate with the seed insertion device; supplying seeds to the growth pocket of the growth substrate via the seed insertion device; removing the seed insertion device from contact with the growth substrate; and closing the growth pocket by elastic force of the growth substrate for forming a closed growth pocket such that the seeds remain in the closed growth pocket inside the growth substrate.
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