SINTERED MATERIAL, METAL SINTERED COMPACT, METHOD FOR PRODUCING SINTERED MATERIAL, METHOD FOR PRODUCING JOINED BODY, AND JOINED BODY

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United States of America Patent

APP PUB NO 20240278321A1
SERIAL NO

18643068

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Abstract

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A sintered material containing silver particles, copper particles, a nitrogen-containing compound, and a reducing agent, in which a primary particle diameter of the silver particles is 200 nm or less, and a volume-based 50% cumulative particle diameter of the copper particles, as measured by laser diffraction/scattering particle diameter distribution measurement, is 1 μm or more.

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Patent Owner(s)

Patent OwnerAddress
OSAKA UNIVERSITYSUITA-SHI OSAKA 565-0871
TOPPAN HOLDINGS INCTOKYO 110-0016

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
CHEN, Chuantong Suita-shi, JP 4 3
SEKIGUCHI, Takuya Tokyo, JP 30 250
SUGANUMA, Katsuaki Suita-shi, JP 40 260

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