COPPER ALLOY FILM WITH HIGH STRENGTH AND HIGH CONDUCTIVITY
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United States of America Patent
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Issued Date -
Aug 22, 2024
app pub date -
Apr 25, 2024
filing date -
May 7, 2021
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Abstract
A method of forming a component can include electrochemically depositing a metallic material onto a carrier component to a thickness of greater than 50 microns. The metallic material can include crystal grains and at least 90% of the crystal grains can include nanotwin boundaries. The metallic material can include a Copper-Silver alloy (Cu—Ag) with between about 0.5-2 at %-Ag.
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