TOOLS AND METHODS FOR SURFACE LEVELING

Number of patents in Portfolio can not be more than 2000

United States of America Patent

APP PUB NO 20240282591A1
SERIAL NO

18171683

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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The present disclosure is directed to a planarization tool having at least one module with a target holder for supporting a target with a metal layer, at least one of a plurality of etch inhibitor dispensers for discharging an etch inhibitor toward the target, and a plurality of nozzles for discharging a chemical etchant at an angle towards the target to perform selective removal of the metal layer for planarization of the target. In an aspect, the plurality of etch inhibitor dispensers and the plurality of nozzles may be combined as a single unit to discharge the chemical etchant and the etch inhibitor together. In another aspect, the plurality of etch inhibitor dispensers and the plurality of nozzles may be configured in a single module or separate modules.

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Patent Owner(s)

Patent OwnerAddress
INTEL CORPORATION2200 MISSION COLLEGE BOULEVARD SANTA CLARA CA 95054

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
ARANA, Leonel Phoenix, US 39 180
CHEN, Shaojiang Chandler, US 13 10
ECTON, Jeremy Gilbert, US 84 33
FADAYOMI, Oladeji Maricopa, US 5 0
PIETAMBARAM, Srinivas Chandler, US 138 192
TINGEY, Matthew Mesa, US 11 14

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