CIRCUIT BOARD, MANUFACTURING METHOD, AND DISPLAY MODULE

Number of patents in Portfolio can not be more than 2000

United States of America Patent

APP PUB NO 20240284608A1
SERIAL NO

18611934

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A circuit board includes an inner wiring substrate and a first side plate. The inner wiring substrate includes a plurality of first connection pads at a side. The first side plate is disposed on the inner wiring substrate and defines a plurality of first holes exposing the first connection pads. Each first hole includes a first end facing the first connection pad and a second end facing away from the first connection pad. A central distance between two adjacent first connection pads is greater than a center distance between two second ends of two adjacent first holes. The first holes are filled with first conductive bodies, each first conductive body is electrically connected to the first connection pad and extends out of the first hole to form a connection portion. A method for manufacturing the circuit board and a display module are also disclosed.

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Patent Owner(s)

Patent OwnerAddress
HONGQISHENG PREC ELECTRONICS QINHUANGDAO CO LTDNot Provided

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Yuan, Gang Shenzhen, CN 19 29
Zhang, Xiao-Juan Qinhuangdao, CN 6 0

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