DUAL-PUMP COOLING CIRCUIT
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United States of America Patent
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Issued Date -
Aug 22, 2024
app pub date -
Feb 16, 2024
filing date -
Feb 17, 2023
priority date (Note) -
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status (Latency Note)
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Abstract
A cooling system includes a first electrical component, a second electrical component, a first coolant pump fluidly coupled to the first electrical component, and a second coolant pump fluidly coupled to an inlet of the first coolant pump and the second electrical component. The first coolant pump is configured to supply a first portion of coolant to the first electrical component. The second coolant pump is configured to supply the first portion of the coolant to the first coolant pump and a second portion of the coolant to the second electrical component. A radiator is fluidly coupled downstream of the first electrical component and the second electrical component and configured to remove thermal energy from the coolant.
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