RESIN FILM
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United States of America Patent
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Issued Date -
Aug 29, 2024
app pub date -
Apr 30, 2024
filing date -
Apr 18, 2022
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Abstract
A resin film that is made of a resin composition containing: a resin component; and a covalent organic framework in which a plurality of linker portions and a plurality of multi-site core portions are connected through covalent bonds. In a preferred configuration, the resin component is a thermoplastic resin, the resin composition has a water absorption rate of 0.1 mass % or less, the resin composition has a melting point of higher than 300° C., the resin composition has a relative permittivity of less than 3.0, and the resin composition has a dielectric loss tangent of less than 0.002.
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