CIRCUIT BOARD AND METHOD OF FABRICATING CIRCUIT BOARD
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United States of America Patent
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N/A
Issued Date -
Aug 29, 2024
app pub date -
Dec 28, 2023
filing date -
Feb 27, 2023
priority date (Note) -
Published
status (Latency Note)
Importance
Abstract
The disclosed circuit board includes: a substrate portion that includes a first insulation layer and a first wiring layer buried by the first insulation layer, and a first element mounting portion and a second element mounting portion disposed on an upper surface of the substrate portion; a first protective layer disposed on the substrate portion; and an auxiliary layer that is disposed to overlap at least a part of a boundary area including a region between the first element mounting portion and the second element mounting portion, and has higher strength than the first protective layer.
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