METHOD OF MANUFACTURING THE PRINTED CIRCUIT BOARD EMBEDDED WITH WAFER LEVEL COMPONENT
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United States of America Patent
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Issued Date -
Aug 29, 2024
app pub date -
Dec 5, 2023
filing date -
Feb 25, 2023
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Abstract
The present invention discloses a fabrication method of thick-walled printed circuit board PCB), especially the packaging substrate for mounting thin wafer level components on the PCB substrate. The present invention provides a first embodiment of inserting a dummy at the circuit board manufacturing stage and a second embodiment of adjusting the thickness by inserting a dummy at the wafer processing stage.
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