Importance

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Abstract

A polishing pad (1) is provided with higher polishing efficiency for polishing an outer circumferential edge part (3d, 3e) of a disc-shaped wafer (3). An unpolished part is less likely to occur during a polishing process with the polishing pad (1), and the polished wafer (3) is cleanable easily. In the polishing pad (1), a polishing surface is formed of a polishing body, and the polishing body includes a base material and polishing particles. The base material is composed of a binder resin and fibers and has a plurality of pores formed therein. The polishing particles are retained in the base material or in the pores and are diamond particles. The polishing pad (1) has a durometer hardness in a range from 16 to 27, a density in a range from 0.58 to 0.81 g/cm³, and an elastic modulus in a range from 21.5 to 37.5 N/mm².

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First Claim