Importance

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Abstract

A release agent for a circuit board resin film being able to release a resin film formed on a circuit board in a short amount of time, having a high resin film fragmentation performance, and having a low environmental burden, is provided. The release agent contains a compound (component (A)) shown in formula (1) and a fatty alcohol (component (B)) having a carbon number of 1-6 and a molecular weight of 30-120, wherein the pH is 13.0-14.0, the content of component (A) is 0.1-5 mass %, and the content of component (B) is 5-40 mass %. Formula (1): R¹—O-(A¹O)a-H, wherein R¹ represents a branched alkyl group having a carbon number of 6-10, A¹O represents an oxyalkylene group having a carbon number of 2-3, and a, which is the average number of added moles of the oxyalkylene group, is from 2 to 15.

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First Claim