Importance

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Abstract

The present inventive concept relates to a substrate treatment apparatus comprising: a chamber; a substrate support portion which supports at least one substrate in the chamber; a first spray portion which sprays a first gas toward the substrate support portion from the upper side of the substrate support portion; a second spray portion which sprays a second gas toward the substrate support portion from the upper side of the first spray portion; and a buffer portion formed between the first spray portion and the second spray portion, wherein the first spray portion includes a plurality of first spray holes and the second spray portion includes a first supply hole which supplies the first gas to the buffer portion and a second spray hole which passes through the buffer portion. The center of an injection port and the center of a discharge port of the first supply hole are spaced apart from each other in the vertical direction, and the discharge port is formed toward a space among the first spray holes.

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First Claim