Importance

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Abstract

There are provided: a resin composition that has low elasticity, is curable at low temperature, and has a long pot life; an electrically conductive adhesive that contains the resin composition; a cured product of the resin composition; and a semiconductor device that contains the electrically conductive adhesive or the cured product of the resin composition. The resin composition contains (A) a radically polymerizable curable resin, (B) a radical polymerization initiator, and (C) a radical polymerization inhibitor. The (C) component contains (C1) a nitrosamine compound. The (A) component contains (A1) a urethane acrylate oligomer. The (A1) component has a mass average molecular weight of 1,600 or more and 20,000 or less. The resin composition is useful as an electrically conductive adhesive, a material for mounting components or a sealing material for protecting components, and an insulating material for reinforcement which are used in the FHE field.

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First Claim