HEATER LIFT ASSEMBLY SPRING DAMPER

Number of patents in Portfolio can not be more than 2000

United States of America Patent

APP PUB NO 20240304471A1
SERIAL NO

18666710

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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In an embodiment, an apparatus comprising: a heater configured to heat a wafer located on a wafer staging area of the heater, the heater comprising a heater shaft extending below the wafer staging area; and a heater lift assembly comprising: a lift shaft configured to move the heater shaft in a vertical direction; a clamp that connects the heater shaft to the lift shaft; and a damper disposed on top of the clamp.

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First Claim

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Patent Owner(s)

Patent OwnerAddress
TAIWAN SEMICONDUCTOR MFG CO LTDNO 8 LI-HSIN RD 6 SCIENCE-BASED INDUSTRIAL PARK HSIN-CHU

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
CHEN, Chun-Ta Hsinchu City, TW 71 627
HSIEH, Chin-Shen Hsinchu City, TW 10 1
HUANG, Cheng-Yi Hsinchu City, TW 82 288
WU, Kai-Wen Hsinchu City, TW 70 89

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