CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
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United States of America Patent
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Issued Date -
Sep 12, 2024
app pub date -
Nov 9, 2023
filing date -
Mar 8, 2023
priority date (Note) -
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Abstract
A circuit board includes: an insulating layer, a solder resist layer disposed on the insulating layer and having first and second openings; first and second connection pads respectively disposed within the first and second openings on the insulating layer; and first and second conductive layers respectively disposed on the first and second connection pads, and configured to protrude more than an upper surface of the solder resist layer and to have different thicknesses. Each of the first and second conductive layers includes a lower conductive layer disposed on a corresponding one of the first and second connection pads and an upper conductive layer disposed on an upper surface of the lower conductive layer.
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