Importance

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Abstract

A wiring substrate includes a core substrate including a through-hole conductor, a resin insulating layer formed on the core substrate, a conductor layer formed on a surface of the resin insulating layer and including a seed layer and an electrolytic plating layer formed on the seed layer, and a via conductor formed in the resin insulating layer such that the via conductor is connected to the through-hole conductor in the core substrate and includes the seed layer and electrolytic plating layer extending from the conductor layer. The core substrate includes a glass substrate such that the through-hole conductor is formed in a through hole penetrating through the glass substrate, and the conductor layer and via conductor are formed such that the seed layer is formed by sputtering and includes an alloy including copper, aluminum, and one or more metals selected from nickel, zinc, gallium, silicon, and magnesium.

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First Claim