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Abstract

Crosslinkable heat-conducting silicone compositions (Y), methods for manufacturing and using the same. Where the compositions (Y) include 5-50% by volume of a crosslinkable silicone composition (S) and 50-95% by volume of at least one thermally conductive filler (Z) having a thermal conductivity of at least 5 W/mK. The compositions (Y) have a thermal conductivity of at least 0.6 W/mK and at least 20% by volume of metallic silicon particles present as thermally conductive fillers (Z) fulfil the following features: (a) the fillers (Z) have a median diameter x50 in the range of 30-150 μm, (b) the fillers (Z) are predominately rounded, and have a width/length ratio (aspect ratio w/l) that is at least 0.76, (c) the fillers (Z) have a distribution range SPAN ((x90−x10)/x50) that is at least 0.40, and (d) the fillers (Z) contain at most 1.5% by weight of silicon particles that are smaller than 2 μm.

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First Claim