COPPER-DIAMOND COMPOSITE, HEAT DISSIPATION MEMBER, AND ELECTRONIC DEVICE
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United States of America Patent
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Issued Date -
Sep 19, 2024
app pub date -
Aug 1, 2022
filing date -
Aug 5, 2021
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Abstract
A copper-diamond composite (30) according to the present invention includes a plurality of diamond particles (20) that are dispersed in a metal matrix (10) containing copper, in which when a particle size distribution of the diamond particles (20) is measured using an image particle size distribution analyzer, a number average of a sphericity distribution of the diamond particles (20) is 0.90 or more.
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