Heat Transfer Device for High Heat Flux Applications and Related Methods Thereof

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United States of America Patent

APP PUB NO 20240310128A1
SERIAL NO

18452018

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A device and related method that provides, but is not limited thereto, a two-phase heat transfer device with unique combination of enhanced evaporation and increased cooling capacity. An advantage associated with the device and method includes, but is not limited thereto, increased cooling capacity per unit area, controlled and optimized evaporation, prevention of boiling, and prevention of drying of the evaporator. An aspect associated with an approach may include, but is not limited thereto, using anon-wetting coating or structure to keep working fluid away from the spaces between elongated members of an evaporator and using a wetting coating or structure to form thin films of working fluid around the distal region of the elongated members. For example it can be used to cool a computer chip, a skin of a hypersonic flying object, parabolic solar collector, turbine or engine blade, or any other heat source that requires high heat flux.

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Patent Owner(s)

Patent OwnerAddress
UNIVERSITY OF VIRGINIA PATENT FOUNDATION722 PRESTON AVENUE SUITE 107 CHARLOTTESVILLE VA 22903

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Haj-Hariri, Hossein Charlottesville, US 9 131
Monazami, Reza Cambridge, US 10 15

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