COMPRESSION GAP CONTROL FOR PAD-BASED CHEMICAL BUFF POST CMP CLEANING

Number of patents in Portfolio can not be more than 2000

United States of America Patent

APP PUB NO 20240316598A1
SERIAL NO

18123746

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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Embodiments of the disclosure include an apparatus and method of cleaning a substrate. A method of cleaning a substrate, includes rotating, a substrate table by first motor, delivering a fluid to a surface of a substrate positioned on a supporting surface of the substrate table of a cleaning module, rotating a cleaning pad at a cleaning speed, and sensing an initial torque value generated by a second motor with a controller, lowering the cleaning pad with a lift actuator assembly until the controller senses a contact torque generated by the second motor. The contact torque is when a pad processing surface of the cleaning pad contacts a surface of the substrate at a contact point. The method includes translating the cleaning pad a cleaning distance towards the substrate by a command from the controller. The cleaning pad is compressed by the translation of the cleaning pad the cleaning distance. The pad processing surface of the cleaning pad is then translated across the substrate supporting surface.

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Patent Owner(s)

Patent OwnerAddress
APPLIED MATERIALS INC3050 BOWERS AVENUE SANTA CLARA CA 95054

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
SAKATA, Clinton P Santa Clara, US 3 5

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