DESIGN RULES FOR SENSOR INTEGRATED SUBSTRATES
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United States of America Patent
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Issued Date -
Sep 26, 2024
app pub date -
May 31, 2024
filing date -
Mar 18, 2019
priority date (Note) -
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status (Latency Note)
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Abstract
Methods of manufacturing a wound monitoring and/or therapy apparatus and/or wound dressing include positioning electronic components and connections in regions of a substrate that are not configured to be perforated. The methods can also include following a set of rules for positioning the components as well as positioning and shaping the connections based on the constraints stemming from, among other things, the positioning of the perforations on the substrate and with the goal of maintaining acceptable levels of signal integrity. The methods further include manufacturing a multi-layered substrate. Wound monitoring and/or therapy apparatus manufactured using such methods are also disclosed.
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