CONDUCTIVE FILM
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United States of America Patent
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Issued Date -
Sep 26, 2024
app pub date -
Mar 18, 2024
filing date -
Mar 20, 2023
priority date (Note) -
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Abstract
A conductive film having excellent adhesiveness of a conductive thin wire after a durability test film includes: a transparent substrate; and a mesh pattern that is disposed on the transparent substrate and is formed of a conductive thin wire, in which the conductive thin wire includes a black layer including carbon black, a palladium-containing layer, and a metal plating layer in order from the transparent substrate side.
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