HIGH-FREQUENCY TRANSMISSION ELEMENT
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United States of America Patent
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Issued Date -
Sep 26, 2024
app pub date -
Apr 10, 2023
filing date -
Mar 22, 2023
priority date (Note) -
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Abstract
A high-frequency transmission element is provided. The high-frequency transmission element includes a connecting wire structure and an impedance matching plate structure. The connecting wire structure includes a connecting wire and a connecting pad. The connecting pad is located at an end of the connecting wire. The impedance matching plate structure includes an impedance matching plate body, an opening, and an impedance matching portion. The connecting pad is located in a projection range of the opening in a direction of orthographic projection of the impedance matching plate structure. The impedance matching portion is located in a periphery of the opening and extends in the direction from the connecting wire towards the connecting pad.
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