FILLER FOR ELECTRONIC MATERIALS AND METHOD FOR PRODUCING SAME, SLURRY FOR ELECTRONIC MATERIALS, AND RESIN COMPOSITION FOR ELECTRONIC MATERIALS
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United States of America Patent
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Issued Date -
Oct 3, 2024
app pub date -
Jun 14, 2024
filing date -
Dec 16, 2021
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Abstract
A filler for electronic material according to the present invention has a silica particle material produced by a dry method, wherein D50 is 0.2 μm or greater and 7.0 μm or less. Further, in the filler for electronic material according to the present invention, (BET specific surface area)/(theoretical specific surface area calculated from D50) is 0.85 or greater and 1.2 or less (requirement 1), and/or D10/D50 is 0.55 or greater and 0.75 or less (requirement 2). When at least one of the requirements 1 and 2 is satisfied, electric characteristics such as a Df value are improved. Here, the BET specific surface area is a value measured by using nitrogen, and D50 is a 50 mass % cumulative diameter, i.e., a median diameter, and means a particle diameter at 50 mass % when the masses of particles are sequentially integrated from smaller particle diameters. Similarly, D10 is a 10 mass % cumulative diameter.
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