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• 15 United States
• 10 France
• 8 Japan
• 7 China
• 5 Korea
• 2 Other

Patent Owner(s)

Patent Owner	Address
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD	8 LI-HSIN RD 6 HSINCHU SCIENCE PARK HSINCHU 300-78

International Classification(s)

• B24B:MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR PO....
• C09K:MATERIALS FOR APPLICATIONS NOT OTHERWISE PROVIDED ....
• H01L:SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICE....
• C09G:POLISHING COMPOSITIONS OTHER THAN FRENCH POLISH; S....

• [Classification Symbol]

• [Patents Count]

Inventor(s)

Inventor Name	Address	# of filed Patents	Total Citations
Chao, Huang-Lin	Hillsboro, US	118	101
Lee, An-Hsuan	Hsinchu, TW	15	2
Lee, Shen-Nan	Hsinchu County, TW	56	195
Liao, Chun-Hung	Taichung, TW	31	13
Tsai, Teng-Chun	Hsinchu City, TW	275	2741
Wu, Chen-Hao	Hsinchu, TW	36	31

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Maintenance Fees

Fee	Large entity fee	small entity fee	micro entity fee	due date
3.5 Year Payment	$1600.00	$800.00	$400.00	Apr 3, 2028
7.5 Year Payment	$3600.00	$1800.00	$900.00	Apr 3, 2032
11.5 Year Payment	$7400.00	$3700.00	$1850.00	Apr 3, 2036

Fee	Large entity fee	small entity fee	micro entity fee
Surcharge - 3.5 year - Late payment within 6 months	$160.00	$80.00	$40.00
Surcharge - 7.5 year - Late payment within 6 months	$160.00	$80.00	$40.00
Surcharge - 11.5 year - Late payment within 6 months	$160.00	$80.00	$40.00
Surcharge after expiration - Late payment is unavoidable	$700.00	$350.00	$175.00
Surcharge after expiration - Late payment is unintentional	$1,640.00	$820.00	$410.00

Full Text

US Patent Application No: 2024/0327,677

CHEMICAL MECHANICAL POLISHING SLURRY COMPOSITION AND METHOD OF POLISHING METAL LAYER

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