BONDING SYSTEM

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United States of America Patent

APP PUB NO 20240327681A1
SERIAL NO

18742857

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A water-based adhesive film-forming cover composition including: (i) at least one film forming polymer; (ii) at least one lower crystallinity first polynitroso compound; (iii) at least one higher crystallinity second polynitroso compound; (iv) at least one crosslinking agent; and (v) water as a carrier liquid; a bonding system including a combination of: (a) a water-based primer component; and (b) the above water-based cover component; a process for manufacturing the above bonding system; and a process of manufacturing a bonded article with the above bonding system. A bonded article, having a bonding line made from the above bonding system disposed between metal and rubber substrates, exhibits excellent stability against an aqueous urea-solution at temperatures of up to about 95° C.

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Patent Owner(s)

Patent OwnerAddress
DDP SPECIALTY ELECTRONIC MATERIALS US LLCWILMINGTON DE 19805

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Becker, Gerd Frankfurt, DE 7 23
Dehnicke, Stefan Seeheim-Jugenheim, DE 8 10
Kistner, David Schwalbach, DE 9 61
Osichow, Anna Hofheim am Taunus, DE 7 1
Zutavern, Philipp Frankfurt, DE 5 1

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