OXIDATION AND CORROSION RESISTANT NANOSTRUCTURED COPPER-BASED METALLIC SYSTEMS
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United States of America Patent
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Oct 3, 2024
app pub date -
Mar 28, 2023
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Mar 28, 2023
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Abstract
Various embodiments are directed to oxidation- and/or corrosion-resistant nanostructured metallic system and techniques for producing such systems. The metallic system may include (i) a solvent of copper (Cu) metal that comprises 50 to 99.98 atomic percent (at. %) of the metallic system, (ii) a first solute of tantalum (Ta) metal dispersed in the solvent metal, the first solute comprising 0.01 to 50 at. % of the metallic system, (iii) a second solute of an oxidation and/or corrosion resistance-inducing metal dispersed in the solvent metal, the second solute comprising 0.01 to 50 at. % of the metallic system, and optionally (iv) a third solute of an additional metal dispersed in the solvent metal, the third solute comprising 0.01 to 50 at. % of the metallic system, the additional metal being an alkali metal, an alkaline earth metal, or a transition metal that is different from the solvent, first solute, and second solute.
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